For quire some time, Huawei has been using their own HiSilicon processor division to build processors for Huawei’s recent devices. This trend has proven success for Huawei and its a very important factor which sets Huawei apart from the most of smartphone manufacturers out there. Only Samsung and Apple is cooking their own chips this at the moment and no other Chinese manufacturer is doing this.

Huawei has recently unveiled the Kirin 930 processor with the release of MediaPad X2 and apart from the GPU, Kirin 930 is an impressive CPU built on the 16nm process when other manufacturers like Qualcomm is still using 20nm for the Snapdragon 810.

Today, the possible upcoming lineup of HiSilicon Kirin CPU’s were leaked and it shows the guts of upcoming Kirin 940 and Kirin 950 processors.

As you can see on the above chart, Kirin 940 and 950 packs some impressive features like

• UFS 2.0
• LPDDR 4 memory
• eMMC 5.1
• BT 4.2 smart
• USB 3.0
• Wi-Fi ac MIMO
• LTE Cat.10
• Dual ISP (42MP)
• ARMv8-A A72 cores

This proves that Huawei has matched and sometimes exceeded the competitors products feature wise. But we have long way to go until the end of this year where Kirin 950 is going to be surfaced and Qualcomm is probably readying Snapdragon 820 for release at the same time. Samsung also will come up with a new iteration of their Exynos series to include on the upcoming Galaxy Note 5 so we cant exactly say that the above features will be class leading at the time of release. But feature wise and comparing with the current generation chips, Kirin 940 and 950 packs a punch and this will create more competition between manufacturers which will result in far better products for the consumers.